“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

Integrated Package all around your life: The conference started in 1992 as "The VLSI Packaging Workshop in Japan" and was renamed to "ICSJ" in 2010 and will focus on a variety of packaging technologies. Internet of Things (IoT) will make revolutionary changes to the packaging technologies for smarter usage of the devices in various application fields such as healthcare, Industry 4.0, automotive, and so on. The IoT will be supported by “Integrated Package” which is composed of various types of devices (sensors, RFIDs, MEMS, wireless components, etc.). Integrated Package is one of the key technologies and exists all around your life. In 2017, the conference will feature three main topics: Fan-Out technologies, Optoelectronics and Heterogeneous Integration Roadmap. Additional topics of primary interest to the participants are listed below.