The 2017 IEEE Radio and Wireless Symposium (RWS2017) will be held during the week of 15 January 2017 in Phoenix, AZ, USA.
RWS2017 and the 17th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits SiRF2017 are co-located and will continue to hold joint sessions.
Topical conferences held in parallel provide more focused sessions in the areas of RF Power Amplifiers (PAWR), Wireless Sensors and Sensor Networks (WiSNet), and the Internet of Space (IOS). The RWS Demonstration Track provides an interactive forum for hands-on demonstration of latest wireless experiments and innovations.
1. High-speed and Broadband Wireless Technologies
Broadband Fixed Wireless and Last-Mile Access
Ultra-High Data Rate Communications Links -
Powerline Communication Technologies
3G/4G Wireless Communication Services
Ultra-Wideband (UWB) Systems
Optical Networks and Systems
2. Emerging Wireless Technologies and Applications
M2M & V2V Technologies & Applications
Resource Management, Security
Femtocell and Heterogeneous Networks
Satellite Network Systems
Green, Sustainable Wireless Tech. & Networks -
Advances in LANs, PANs, BANs, MANs, RANs
3. Wireless System Architecture and Modeling
Ad Hoc Network Techniques for Internetworking
Distributed Network Architectures
Cellular Architectures and Systems
Wireless Mesh and Broadband Local/Personal/ Body Area Networks
Wireless Security and RFID Technologies
4. Propagation/Channel Modeling and Utilization
Propagation/Channel Characterization & Modeling -Fading Countermeasures
Spectrum Sensing Technologies
Frequency and Channel Allocation Algorithms
5. Digital Signal Processing, SDR, & Cognitive Radio
Digital/Analog Adaptive/Collaborative Signal Processing
Methods for Maintaining Signal Integrity and Signal Conditioning
Interference mitigation and Cancellation Techniques
Software/Hardware architectures, Algorithms
MAC, Networking protocols, Regulatory Policies, Standardization
Dynamic Spectrum Sharing, Coexistence, Interoperability
6. Applications to Bio-medical, Environmental, and Internet of Things
Miniaturization and integration of wireless technologies and micro sensors
Personal area networks and body area sensor networks
Wireless positioning technologies & remote sensing
7. MIMO and Multi-Antenna Communications
MIMO, MU-MIMO, Space-Time Processing – Relaying Technologies
Cooperative/Collaborative Technology
Multi-Beam Smart Antennas
8. Antenna Technologies
Passive & Active Antennas from RF to THz Frequencies
Miniaturized, Multi-frequency and Broadband Antennas
Wireless Platform Integrated Antennas - Vehicular and Satellite Antennas
9. Transceiver & Front-end Technologies, SOC & SiP
Receiver, Transmitter and Transceiver Components -Active Circuits and Sub-systems
Multi-Standard Circuits and Sub-systems
Low-Power/Low Noise RF/Analog IC and System-OnChip
Highly Integrated Transceivers for Sensing and Imaging
10. Passive Components & Packaging
Discrete, Embedded and Distributed Passive components
Filters, Couplers and Signal Separation Devices
Discrete and Highly Integrated Packaging
3D-packaging, Interconnects, TSV Technologies and Applications
Packaging of MEMs, Biosensors, Organic ICs, THz Electronics, Optoelectronics - Reliability Issues
11. MM-Wave to THz Technology & Applications
Device and circuit concept & demonstration
Unique receivers and transmitters - Integrated circuits
Wireless links, Arrays & Applications
12. 3D & Novel Engineered Materials
Additive 3D manufacturing for wireless components and systems
Novel engineered materials for antenna, packaging, passive devices and flexible electronic integration
01月15日
2017
01月18日
2017
注册截止日期
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