活动简介

The 2017 IEEE Radio and Wireless Symposium (RWS2017) will be held during the week of 15 January 2017 in Phoenix, AZ, USA.

RWS2017 and the 17th IEEE Topical Meeting on Silicon Monolithic Integrated Circuits SiRF2017 are co-located and will continue to hold joint sessions.

Topical conferences held in parallel provide more focused sessions in the areas of RF Power Amplifiers (PAWR), Wireless Sensors and Sensor Networks (WiSNet), and the Internet of Space (IOS). The RWS Demonstration Track provides an interactive forum for hands-on demonstration of latest wireless experiments and innovations.

征稿信息

征稿范围

1. High-speed and Broadband Wireless Technologies

  • Broadband Fixed Wireless and Last-Mile Access

  • Ultra-High Data Rate Communications Links -

  • Powerline Communication Technologies

  • 3G/4G Wireless Communication Services

  • Ultra-Wideband (UWB) Systems

  • Optical Networks and Systems

2. Emerging Wireless Technologies and Applications

  • M2M & V2V Technologies & Applications

  • Resource Management, Security

  • Femtocell and Heterogeneous Networks

  • Satellite Network Systems

  • Green, Sustainable Wireless Tech. & Networks -

  • Advances in LANs, PANs, BANs, MANs, RANs

3. Wireless System Architecture and Modeling

  • Ad Hoc Network Techniques for Internetworking

  • Distributed Network Architectures

  • Cellular Architectures and Systems

  • Wireless Mesh and Broadband Local/Personal/ Body Area Networks

  • Wireless Security and RFID Technologies

4. Propagation/Channel Modeling and Utilization

  • Propagation/Channel Characterization & Modeling -Fading Countermeasures

  • Spectrum Sensing Technologies

  • Frequency and Channel Allocation Algorithms

5. Digital Signal Processing, SDR, & Cognitive Radio

  • Digital/Analog Adaptive/Collaborative Signal Processing

  • Methods for Maintaining Signal Integrity and Signal Conditioning

  • Interference mitigation and Cancellation Techniques

  • Software/Hardware architectures, Algorithms

  • MAC, Networking protocols, Regulatory Policies, Standardization

  • Dynamic Spectrum Sharing, Coexistence, Interoperability

6. Applications to Bio-medical, Environmental, and Internet of Things

  • Miniaturization and integration of wireless technologies and micro sensors

  • Personal area networks and body area sensor networks

  • Wireless positioning technologies & remote sensing

7. MIMO and Multi-Antenna Communications

  • MIMO, MU-MIMO, Space-Time Processing – Relaying Technologies

  • Cooperative/Collaborative Technology

  • Multi-Beam Smart Antennas

8. Antenna Technologies

  • Passive & Active Antennas from RF to THz Frequencies

  • Miniaturized, Multi-frequency and Broadband Antennas

  • Wireless Platform Integrated Antennas - Vehicular and Satellite Antennas

9. Transceiver & Front-end Technologies, SOC & SiP

  • Receiver, Transmitter and Transceiver Components -Active Circuits and Sub-systems

  • Multi-Standard Circuits and Sub-systems

  • Low-Power/Low Noise RF/Analog IC and System-OnChip

  • Highly Integrated Transceivers for Sensing and Imaging

10. Passive Components & Packaging

  • Discrete, Embedded and Distributed Passive components

  • Filters, Couplers and Signal Separation Devices

  • Discrete and Highly Integrated Packaging

  • 3D-packaging, Interconnects, TSV Technologies and Applications

  • Packaging of MEMs, Biosensors, Organic ICs, THz Electronics, Optoelectronics - Reliability Issues

11. MM-Wave to THz Technology & Applications

  • Device and circuit concept & demonstration

  • Unique receivers and transmitters - Integrated circuits

  • Wireless links,  Arrays & Applications

12. 3D & Novel Engineered Materials

  • Additive 3D manufacturing for wireless components and systems

  • Novel engineered materials for antenna, packaging, passive devices and flexible electronic integration

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    01月15日

    2017

    01月18日

    2017

  • 01月18日 2017

    注册截止日期

历届会议
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询