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活动简介

The workshop will take place on Monday, September 5, 2016 at the SISPAD conference location (Le Meridien Grand Hotel).

The workshop fee is 60 EUR and includes workshop proceedings (printed handout of the slides), lunch, and coffee breaks.

To register for the workshop choose the workshop option "WS1" in the online registration form or just send an e-mail to info@sispad2016.org. You can register for the workshop independent of the registration for the conference.

The impact of interconnects on circuit performance and reliability is increasing as dimensions shrink down to the several nanometer range. Software modules addressing interconnect issues on different levels therefore gain significant importance. Within the SISPAD 2016 workshop "Simulation of Advanced Interconnect" presentations from industry and research will highlight the most important challenges and will provide insight into capabilities of existing simulation modules for interconnects and into future developments of technology and modeling approaches. Software demonstrations will allow you to gain insight into the different software modules and their interaction.

征稿信息

重要日期

2016-04-15
摘要截稿日期
2016-06-06
摘要录用日期
2016-07-04
初稿截稿日期

征稿范围

• Process simulation and modeling
• Equipment simulation
• Material modeling
• Electronic transport in semiconductor materials and devices
• Device simulation
• Interconnect modeling and algorithms
• Models of VLSI device scaling limits
• Compact modeling for circuit simulation
• Integration of process, device and circuit simulation
• Simulation of variability
• Advanced numerical methods and algorithms
• Fundamental aspects of device modeling and simulation
• Benchmarking, calibration and verification of simulators

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重要日期
  • 09月05日

    2016

    会议日期

  • 04月15日 2016

    摘要截稿日期

  • 06月06日 2016

    摘要录用通知日期

  • 07月04日 2016

    初稿截稿日期

  • 09月05日 2016

    注册截止日期

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