活动简介

“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

The age of IoT: The conference started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to "ICSJ" in 2010. Topics include a variety of packaging technologies, ranging from VLSI, 3D packaging, optoelectronics, bio and healthcare. In 2016 the conference will emphasize two main topics: IoT and Power electronics. The Internet of Things (IoT) will make revolutionary changes to the packaging technologies for smarter usage of the devices (sensors, RFIDs, MEMS, wireless components, etc.) in various application fields such as healthcare, Industry 4.0, automotive, and so on. Furthermore, for future automated automotive driving technologies and connected car will be driven by a collaboration of IoT and power electronics. 

征稿信息

重要日期

2016-05-27
摘要截稿日期
2016-09-09
初稿截稿日期
2016-07-08
初稿录用日期

征稿范围

  • 3D Packaging & Chip on Chip

  • Advanced Fine Pitch Packaging, Micro Bumping, Wafer Level CSP

  • Board-Level Integration

  • Integrated Substrate

  • Laminated Materials & Processing, Materials for Packaging

  • Thermal Management

  • Reliability & Failure Mechanisms

  • Packaging for High-Speed Electrical Interconnect

  • Signal Integrity / Power Integrity

  • RF Components & Modules

  • Packaging for Automotive & Power Electronics

  • Additive Manufacturing, 3D Printed Electronics

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重要日期
  • 会议日期

    11月07日

    2016

    11月09日

    2016

  • 05月27日 2016

    摘要截稿日期

  • 07月08日 2016

    初稿录用通知日期

  • 09月09日 2016

    初稿截稿日期

  • 11月09日 2016

    注册截止日期

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