“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.
The age of IoT: The conference started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to "ICSJ" in 2010. Topics include a variety of packaging technologies, ranging from VLSI, 3D packaging, optoelectronics, bio and healthcare. In 2016 the conference will emphasize two main topics: IoT and Power electronics. The Internet of Things (IoT) will make revolutionary changes to the packaging technologies for smarter usage of the devices (sensors, RFIDs, MEMS, wireless components, etc.) in various application fields such as healthcare, Industry 4.0, automotive, and so on. Furthermore, for future automated automotive driving technologies and connected car will be driven by a collaboration of IoT and power electronics.
3D Packaging & Chip on Chip
Advanced Fine Pitch Packaging, Micro Bumping, Wafer Level CSP
Board-Level Integration
Integrated Substrate
Laminated Materials & Processing, Materials for Packaging
Thermal Management
Reliability & Failure Mechanisms
Packaging for High-Speed Electrical Interconnect
Signal Integrity / Power Integrity
RF Components & Modules
Packaging for Automotive & Power Electronics
Additive Manufacturing, 3D Printed Electronics
11月07日
2016
11月09日
2016
摘要截稿日期
初稿录用通知日期
初稿截稿日期
注册截止日期
2024年11月13日 日本 Kyoto
2024 IEEE CPMT Symposium Japan (ICSJ)2022年11月09日 日本 Kyoto
2022 IEEE CPMT Symposium Japan2021年11月10日 日本 Kyoto
2021 10th IEEE CPMT Symposium Japan2018年11月19日 日本
2018 IEEE CPMT Symposium Japan2017年11月20日 日本 Kyoto,Japan
2017 IEEE CPMT Symposium Japan2015年11月09日 日本
2015年IEEE器件,封装与制造技术协会日本研讨会2014年11月04日 日本
2014年IEEE元件,封装与制造技术日本研讨会2013年11月11日 日本
IEEE CPMT 国际包装技术研讨会
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