“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology. Packaging is everywhere! The conference started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to “ICSJ” in 2010. Topics include a variety of packaging technologies, ranging from VLSI and 3D packaging, optoelectronics, bio and healthcare. In 2015 the conference will emphasize two main topics: Optoelectronics and Bio-healthcare. Optoelectronics will include optical interconnect, Si Photonics, telecom/datacom, and LEDs. Bio-healthcare will cover bioelectronics, sensing, biomimetics, and wearable devices. Advanced topics of primary interest to the participants include Advanced Packaging, Thermal and Reliability, and RF and Electrical Interconnect. This year, ICSJ will have a special session on 3D Printing."