2024 IEEE 17th International Conference on Signal Processing (ICSP)

活动简介

Sponsored by IEEE Beijing Section and Beijing Jiaotong University, the ICSP 2024 is the 17th one of the ICSP conference series, which began from 1990 in Beijing. During the past 34 years theory and technology of signal processing have been advanced extremely quickly and spread widely in all the disciplines of engineering and scientific fields. Signal processing has also a great effect on the day-to-day life of the human beings. To keep the pace with the technology development and the state of art of applications, the ICSP is being held once every two years. The 17th IEEE ICSP will bring together diversity of authors and speakers from many nations and regions to share ideas and new perspectives in both theoretical and practical aspects of signal processing.

组委会

Conference Co-Chairmen:

LONG Teng	China
LI Fu	U.S.A.
ZHENG Baoyu	China

Conference Advisers

YUAN Baozong	China
XIE Weixin	China
FUJSAKI Hiroya	Japan

Technical Program Committee Chairman:

WEI Shikui

China

Technical Program Committee Co-Chairmen

HIROSE Heikichi	Japan
LI Fu	U.S.A.
ZHU YueMin	France
TAO JianHua	China

Local Arrangement Committee:

CEN YiGang	China
YANG Feng	China
JIN Yi	China

Regional Committee:

America Committee Chairman：	Sun, M.G.	U.S.A.
Australia Committee Chairman：	Chen, F.	Australia
Canada Committee Chairman：	Zhang, J.K.	Canada
Europe Committee Chairman：	Zhu, Y. M.	France
Japan Committee Chairman：	Hirose, K.	Japan
Korea Committee Chairman：	Lee, M.H.	Korea
South Asia Committee Chairman：	Ma, K.-K.	Singapore

Technical Program Committee:

Barner, K.E.	France
Blu, T.	U.S.A.
Cambria,E.	Singapor
Chan,Y.T.	Canada
Chassery J.M.	France
Cheung, G.	Japan
Constantinides,A.G.	U.K.
David,A.G.	U.S.A.
Delachartre, P.	France
Djuric,P.M.	U.S.A.
Dooley,L.	U.K.
Du, W.C.	Macao, China
Dufaux,F.	France
Durrani,T.S.	U.K.
Er,M.H.	Singapore
Flandrin,P.	France
Fujisaki,H.	Japan
Furui,S.	Japan
Ghogho,M.	U.K.
Hinamoto,T.	Japan
Huang,G.	Canada
Jannaron,R.J.	U.S.A.
Juang,B-H.	U.S.A.
Kaveh,M.	U.S.A.
Kittler,J.	U.K.
Knoll,A.	Germany
Kuo,G.S.	U.S.A.
Lee,C.H.	U.S.A.
Lee,S.	Korea
Li,F.	U.S.A.
Liang,W.L.	U.K.
Lueder,E.	Germany
Luo, J.H.	China
Luo,Z.Q.	U.S.A.
Maitre,H.	France
Maragos,P.	Greece
Moraga,C.	Germany
Ng,T.S.	Hong Kong,China
Scharf,L.	U.S.A.
Siu,W.C	Hong Kong,China
Shi,Y.Q.	U.S.A.
Sun, Y.N.	Taiwan,China
Tang,Y.Y.	Hong Kong,China
Touradj, E.	Switzerland
Wong,K.M.	Canada
Yahagi,T.	Japan
Zhang,Y.X.	U.S.A.
Bao Changchun	China
Fu Shujun	China
Huang Jianguo	China
Huang Jiwu	China
Huang Tiejun	China
Li Bo	China
Li Hongwei	China
Li Hua	China
Li Shutao	China
Li Shuangtian	China
Liu Chenglin	China
Long Teng	China
Ma Jinwen	China
Ma Siwei	China
Ma Xiaochuan	China
Mao Shiyi	China
Pan Jeng-Shyang	China
Qiu Zhengding	China
Sun Hong	China
Wang LiHui	China
Wang Yiding	China
Wei Shikui	China
Wu Feng	China
Wu Renbiao	China
Xie Weixin	China
Xu Changsheng	China
Yu Yibiao	China
Yuan Baozong	China
Zhang Su	China
Zhang Yujin	China
Zheng Baoyu	China
Zheng Yuan	China

征稿信息

重要日期

2024-06-15

初稿截稿日期

Scope and Topics

A. Signal Processing
B. AI & Deep Learning
C. Large Language Model
D. Big Data & Blockchain
E. Autonomous driving
F. Information Retrieval
G. Multimodal learning
H. Artificial General Intelligence
I. Image Processing & Understanding
J. Speech Coding & Recognition
K. Embodied Artificial Intelligence
L. Image/Video Compression & Retrieval
M. Computer Vision & Graphics
N. Machine Learning & Pattern Recognition
O. Human-computer Interaction
P. Brain Interface
Q. Communication Signal Processing & 5th Generation
R. Vision, language, and reasoning
S. Virtual Reality & Augmented Reality
T. Medical and biological vision
U. Biometric recognition Technology
V. Internet of Things
W. Radar/Sonar Signal Processing
X. Robotics & Active agents
Y. Hardware Implementation
Z. Applications and Systems