73 / 2024-07-12 21:01:38
Development of the high-rate capable DLC-RPC based on the current evacuation pattern
Resistive plate chamber,Diamond-like carbon
摘要录用
Masato Takahashi / Kobe University
Sei Ban / The University of Tokyo
Weiyuan Li / The University of Tokyo
Atsuhiko Ochi / Kobe University
Wataru Ootani / The University of Tokyo
Atsushi Oya / The University of Tokyo
Hiromu Suzuki / Kobe University
Kensuke Yamamoto / The University of Tokyo
The DLC-RPC, a thin resistive plate chamber based on diamond-like carbon (DLC) electrodes, is being developed for further background suppression in the MEG II experiment. The detector should have ultra-low mass (\(< 0.1~\%~X_0\)) and high-rate capability (up to \(3~\rm{MHz/cm^2}\)) due to high-intensity (\(7 \times 10^7~/\rm{s}\)) and low-momentum (\(28~{\rm MeV/}c\)) muon beam passing through it. Additionally, the detector must have high efficiency (\(> 90~\%\)) for MIP particles to identify background events efficiently. The DLC-RPC consists of thin polyimide films as the substrate to minimize the material budget and spacing pillars (\(\sim 350\) μ\(\rm m\) thick) formed by photolithographic technology. The prototype detector was verified to have a rate capability of up to \(1~{\rm MHz/cm^2}\) using an actual muon beam. We have developed the DLC-RPC with low resistivity (\(\sim 10 {\rm M\Omega/sq}\)) and strip-shaped current evacuation patterns to improve the rate capability. However, discharges tend to occur near the evacuation patterns due to the lower quench of the resistive electrode as the current path shortens. We have studied the discharge phenomena near the evacuation patterns with low-resistivity DLC in parallel plate geometry using the prototype DLC-RPC electrode, produced by the CERN Micro-Pattern Technologies workshop. We have also investigated the design of protection covers on the evacuation patterns to mitigate these discharges.
重要日期
  • 会议日期

    10月14日

    2024

    10月18日

    2024

  • 07月15日 2024

    初稿截稿日期

  • 07月25日 2024

    摘要录用通知日期

  • 10月16日 2024

    注册截止日期

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University of Science and Technology of China
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