IEEE COMCAS 2023 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications and sensors, antennas, propagation and scattering, RF/MW devices and circuits, RFICs, signal processing and imaging, microwave systems, radar, acoustics, bio-medical engineering, automotive radar and communications, electronic packaging and thermal management. It includes a technical program, industry exhibits, and invited talks by international experts in key topical areas.
Sponsor Type:1; 1; 1; 1; 2; 3; 5; 5; 9
Conference Chair:
Shmuel Auster
Chair, IEEE Israel Section
Treasurer:
Robert C. Shapiro
IEEE R5 Past Director
IEEE COMSOC Past Treasurer
Local Arrangements Chair:
Idit Schaffer
AEAI, Israel
Social Functions and Hospitality:
Meira Auster
Alona Boag
Communications and Sensors
Antennas, Propagation, and Scattering
Electronic Packaging & Thermal Management
Biomedical Engineering
RF/MW Circuits and Devices
Microwave Systems, Radar, Acoustics
Signal Processing and Imaging
11月06日
2023
11月08日
2023
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