Wide bandgap and other emerging semiconductor materials (e.g. ionic materials) based electronic devices: characterization, modelling and design Advanced silicon, integrated passive devices and through substrate via Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applicationsFan-out wafer/panel level packaging for 5G mmWave and IoT, etc. Flexible materials for RF electronics and antennas Engineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation Ferromagnetic materials and superconducting materials Spin-wave and magnetic crystal materials Passive/active microwave and terahertz devices (material characterization, fabrications, and applications) Antennas with advanced/complex/artificial materials and processes
Sponsor Type:1
11月13日
2023
11月15日
2023
注册截止日期
2022年11月13日 中国 Guangzhou
2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2021年11月15日 中国 Chongqing
2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2018年07月16日 美国
2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2017年09月20日 意大利 Pavia
2017 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications2016年07月20日 中国 Chengdu, China
2016 IEEE MTT-S International Microwave Workshop Serieson Advanced Materials and Processes for RF and THz Applications
留言