活动简介

Design Methodologies, Verification Within-die circuits for process characterization/monitoring, design enablement – characterization and validation of digital and analog libraries and devices and circuit modeling. DC, AC and RF measurements: setup, test and analysis, Reliability test - including thermal stability, failure analysis, prediction, etc. Statistical analysis, variability, throughput increase, smart test strategies. Use of machine learning and AI in analysis of data sets - parameter extraction etc. Wafer probing, within-die measurements, in-line metrology. Throughput, testing strategies, yield enhancement and process control tests. Applications: Emerging memory technologies (single cell, arrays, and application in neural networks), emerging transistor technologies for digital/analog/power applications, photonic devices - silicon integration, new displays (OLED, μ-displays), flexible electronics and sensors. M(N)EMS, actuators, sensors, PV cells and other emerging devices.

Sponsor Type:1; 9

组委会

General Chair:

Satoshi Habu
Keysights Technologies, Japan

Technical Program Chair:

Yuzo Fukuzaki
TechInsights

Tutorial Chair:

Tatsuya Ohguro
Toshiba Electronic Devices & Storage
Corporation

征稿信息

重要日期

2022-10-15
摘要截稿日期

征稿范围

Original papers are solicited presenting new developments in topics relevant to ICMTS, including but not limited to, test structures, measurements, and results, in the following areas:

Design

Methodologies, Verification
Within-die circuits for process characterization/monitoring
Design enablement – Characterization and validation of digital and analog libraries
Devices and Circuit Modeling

Measurement techniques

DC, AC and RF measurements: setup, test and analysis
Reliability test - including thermal stability, failure analysis, prediction, etc.
Statistical analysis, variability, throughput increase, smart test strategies
Use of machine learning and AI in analysis of data sets - parameter extraction etc.
Wafer probing, within-die measurements, in-line metrology
Throughput, testing strategies, yield enhancement and process control tests

Applications

Emerging memory technologies (single cell, arrays, and application in neural networks)
Emerging transistor technologies for digital/analog/power applications
Photonic devices - silicon integration, new displays (OLED, ?-displays)
Flexible electronics and sensors (organic and inorganic materials)
M(N)EMS, actuators, sensors, PV cells and other emerging devices

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重要日期
  • 会议日期

    03月27日

    2023

    03月30日

    2023

  • 10月15日 2022

    摘要截稿日期

  • 03月30日 2023

    注册截止日期

主办单位
Electrical and Electronic Information Academic Progress Foundation
IEEE Electron Devices Society
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