Design Methodologies, Verification Within-die circuits for process characterization/monitoring, design enablement – characterization and validation of digital and analog libraries and devices and circuit modeling. DC, AC and RF measurements: setup, test and analysis, Reliability test - including thermal stability, failure analysis, prediction, etc. Statistical analysis, variability, throughput increase, smart test strategies. Use of machine learning and AI in analysis of data sets - parameter extraction etc. Wafer probing, within-die measurements, in-line metrology. Throughput, testing strategies, yield enhancement and process control tests. Applications: Emerging memory technologies (single cell, arrays, and application in neural networks), emerging transistor technologies for digital/analog/power applications, photonic devices - silicon integration, new displays (OLED, μ-displays), flexible electronics and sensors. M(N)EMS, actuators, sensors, PV cells and other emerging devices.
Sponsor Type:1; 9
General Chair:
Satoshi Habu
Keysights Technologies, Japan
Technical Program Chair:
Yuzo Fukuzaki
TechInsights
Tutorial Chair:
Tatsuya Ohguro
Toshiba Electronic Devices & Storage
Corporation
Original papers are solicited presenting new developments in topics relevant to ICMTS, including but not limited to, test structures, measurements, and results, in the following areas:
Design
Methodologies, Verification
Within-die circuits for process characterization/monitoring
Design enablement – Characterization and validation of digital and analog libraries
Devices and Circuit Modeling
Measurement techniques
DC, AC and RF measurements: setup, test and analysis
Reliability test - including thermal stability, failure analysis, prediction, etc.
Statistical analysis, variability, throughput increase, smart test strategies
Use of machine learning and AI in analysis of data sets - parameter extraction etc.
Wafer probing, within-die measurements, in-line metrology
Throughput, testing strategies, yield enhancement and process control tests
Applications
Emerging memory technologies (single cell, arrays, and application in neural networks)
Emerging transistor technologies for digital/analog/power applications
Photonic devices - silicon integration, new displays (OLED, ?-displays)
Flexible electronics and sensors (organic and inorganic materials)
M(N)EMS, actuators, sensors, PV cells and other emerging devices
03月27日
2023
03月30日
2023
摘要截稿日期
注册截止日期
2025年03月24日 美国 San Antonio
2025 IEEE 37th International Conference on Microelectronic Test Structures (ICMTS)2021年04月12日 美国 Cleveland
2021 IEEE 34th International Conference on Microelectronic Test Structures2018年03月19日 美国
2018 IEEE International Conference on Microelectronic Test Structures2017年03月28日 法国 Grenoble,France
30th International Conference on Microelectronic Test Structures2016年03月28日 日本 Yokohama
2016年微电子测试结构国际会议2014年03月24日 意大利
2014微电子测试结构国际会议2013年03月25日 日本
2013年IEEE国际微电子测试结构会议
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