活动简介

AboutComponents, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics
Keywords:Electronics Packaging,
Scope:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Sponsor Type:1

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重要日期
  • 会议日期

    05月26日

    2030

    06月01日

    2030

  • 06月01日 2030

    注册截止日期

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IEEE Electronics Packaging Society
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