Pending sponsorship by the ACM Special Interest Group on Design Automation (SIGDA), the IEEE Circuits and Systems Society (CASS) and the IEEE Council on Electronic Design Automation (CEDA). The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design, and optimization, to system software and applications.
Organizing Committee
General Co-Chairs
Helen Li, Duke University
Charles Augustine, Intel
Technical Program Co-Chairs
Ayse Kivilcim Coskun, Boston University
Swaroop Ghosh, Penn State University
Treasurer
Weichen Liu
Local Arrangements Chair
Ayse Kivilcim Coskun, Boston University
Zoom Arrangements
Xiang Chen, GMU
Web/Registration Chair
Hiwot Tadese Kassa, UMich
Publications Chair
Fan Chen, IU
Design Contest Co-Chairs
Kapil Dev, Nvidia
Marco Donato, Tufts University
Publicity Chair
Linghao Song, UCLA
1. Technology, Circuits, and Architecture
1.1. Technologies
Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical, printable, biomedical, battery, and alternative energy storage devices and technology enablers for non-Boolean and quantum/quantum-inspired compute models.
1.2. Circuits
Low-power circuits for logic, memory, reliability, clocking, resiliency, near-/sub-threshold, and assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging and DC-DC converters; Energy-efficient circuits for emerging applications (e.g., biomedical, in-vitro sensing, autonomous), circuits using emerging technologies; Cryogenic circuits.
1.3. Logic and Architecture Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics, and other special purpose cores), cache, memory, arithmetic/signal processing, cryptography, variability, asynchronous design, and non-conventional computing.
2. EDA, Systems, and Software
2.1. CAD Tools and Methodologies
CAD tools and methodologies for low-power and thermalaware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.
2.2. Systems and Platforms Low-power, power-aware, and thermal-aware system design including data-center power delivery and cooling, Platforms for SoCs, embedded systems, approximate and brain-inspired computing, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and system-level power implications due to reliability and variability.
2.3. Software and Applications
Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, power optimizations through HW/SW interactions, and emerging software low-power applications.
3. Crosscutting Themes
3.1. AI/ML Hardware Low-power
AI/ML techniques including approximations, application driven optimizations, in-memory/energy-efficient accelerations, and neuromorphic computing; Efficient AI/ML using emerging technologies (including quantum computing).
3.2. Hardware and System
Security Low-power hardware security primitives (PUF, TRNG, cryptographic/post-quantum cryptographic accelerators), nanoelectronics security, supply chain security, IoT security and AI/ML security; Energy-efficient approaches to system security.
4. Industrial Design Track
SLPED’22 solicits papers for an “Industrial Design” track to reinforce interaction between the academic research community and industry. Industrial Design track papers have the same submission deadline as regular papers and should focus on similar topics, but are expected to provide a complementary perspective to academic research by focusing on challenges, solutions, and lessons learnt while implementing industrial-scale designs.
08月01日
2022
08月03日
2022
摘要截稿日期
初稿截稿日期
初稿录用通知日期
注册截止日期
2023年08月07日 奥地利 Vienna
2023 IEEE/ACM International Symposium on Low Power Electronics and Design2021年07月26日 美国 Boston
2021 ACM/IEEE International Symposium on Low Power Electronics and Design2018年07月23日 美国
2018 IEEE / ACM低功耗电子与设计国际研讨会2017年07月24日 台湾-中国 Taipei
2017 IEEE / ACM国际低功率电子设计研讨会2016年08月08日 美国 San Francisco,USA
2016国际低功耗电子学与设计研讨会2015年07月22日 意大利
2015年IEEE/ ACM国际低功耗电子和设计研讨会2014年08月11日 美国
2014年低功耗电子设计国际研讨会
留言