2022 China Semiconductor Technology International Conference CSTIC

活动简介

Plan now to participate at CSTIC 2022, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE-EDS, co-organized by IMECAS, CSTIC 2022 will be held on June 20-21, 2022 in Shanghai, China. Virtual CSTIC conference will be held on June 20-July 15, 2022 on the SEMI Cloud. The conference will have nine symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology will also be addressed in the conference.

组委会

International Advisory Committee Members
	Dr. T. C. Chen Chair IBM Fellow and VP, IBM T.J. Watson Research Center, USA	Dr. Minhwa Chi Co-Chair SVP/TD, SiEn (Qingdao) Integrated Circuits Co.
	Dr. Philip Wong Co-Chair Professor, Stanford University, USA	Dr. Georg Bednorz Member IBM Fellow, Nobel Laureate, Switzerland
	Dr. Qingyuan Han Member Hans Consulting International, USA	Dr. Kinam KIM Member Vice Chairman & CEO, Samsung Electronics, Korea
	Mrs. Ying Shi Member ICMTIA, China	Dr. Hailing Tu Member GRINM, China
	Dr. Shichang Zou Member Chinese Academy of Sciences, China	Dr. Edward Y. Chang Member National Chiao Tung University, Taiwan, China
	Dr. Shaojun WEI Member Professor, Tsinghua Universtiy, China	Dr. Chenming HU Member Professor, UC Berkeley, USA
Steering Committee Advisors
	Mr. Lung Chu President，SEMI China Vice President，SEMI	Dr. Hiroshi IWai Member NYCU, Taiwan, China
	Dr. Tomi T. Li Member National Taiwan Central University	Dr. David P. Huang Member Intel, USA
	Dr. Lode Lauwers Member VP, IMEC, Belgium
Conference Executive Committee Members
	Dr. Hanming Wu Conference Chair Dean of the School of Micro-nano-Electronics, Zhejiang University, China	Dr. Beichao Zhang Symp-IV Chair, Conference Co-Chair, Publicity Chair AVP, HFC Semiconductor, China
	Dr. Ru Huang Symp-I Chair, Conference Co-Chair Professor and Vice President, Peking University, China	Dr. Cor Claeys Conference Co-Chair and Award Selection Chair Professor, KU Leuven, Belgium
	Dr. Linyong (Leo) Pang Symp-II Chair VP, D2S Inc.	Dr. Ying ZHANG Symp-III Chair VP, Naura, USA
	Dr. Xinping Qu Symp-V Chair Professor, Fudan University, China	Dr. Peilin Song Symp-VI Chair, Conference Co-Chair, Publicity Chair Manager, IBM T.J.Watson Research Center, USA
	Dr. Steve X. Liang Symp-VII Chair CEO of JCET Semiconductor (Shaoxing) Co., Ltd., China	Dr. Qinghuang Lin Symp-VIII Chair Director, Lam Research Corporation, USA
	Prof. Cheng Zhuo Symp-IX Chair Professor, Zhejiang University, China	Dr. Hsiang-Lan Lung Poster Chair Director MXIC, Taiwan, China

征稿信息

重要日期

2021-10-15

摘要截稿日期

2021-11-15

摘要录用日期

2021-12-26

终稿截稿日期

征稿范围

Scope of Paper Solicited: We aim to provide a platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology. It also offers opportunities for those who are interested in investing and collaboration in the semiconductor industry in Asia, particularly in China. We are soliciting papers from authors around the world on all aspects of semiconductor technology and manufacturing, including device engineering and technology, Front-End-of-Line (FEOL), Back-End-of-Line (BEOL), packaging, metrology and testing, as well as emerging semiconductor technologies and IC design.

Topics to be addressed at CSTIC 2022 include, but are not limited to the following:

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems

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重要日期

会议日期

06月20日

2022

至

06月21日

2022
10月15日 2021

摘要截稿日期
11月15日 2021

摘要录用通知日期
12月26日 2021

终稿截稿日期
06月21日 2022

注册截止日期

主办单位

IEEE Electron Devices Society
Semiconductor Equipment and Material International Trade Group - SEMI

联系方式

ap******@semichina.org

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历届会议

2024年03月17日中国 Shanghai
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
2023年06月26日中国 Shanghai
2023 China Semiconductor Technology International Conference
2019年03月17日中国
2019 China Semiconductor Technology International Conference
2018年03月11日中国
2018 China Semiconductor Technology International Conference
2017年03月12日中国 Shanghai,China
2017中国国际半导体技术大会
2016年03月13日中国 Shanhai, China
2016 China Semiconductor Technology International Conference
2015年03月15日中国上海市
2015中国国际半导体技术大会

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2022 China Semiconductor Technology International Conference (CSTIC)

活动简介

组委会

征稿信息

重要日期

征稿范围

留言

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重要日期

会议日期

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历届会议