Jointly sponsored by ACM and IEEE, ICCAD is the premier forum to explore the new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. ICCAD covers the full range of CAD topics – from device and circuit-level up through system-level, as well as post-CMOS design. ICCAD has a long-standing tradition of producing a cutting-edge, innovative technical program for attendees. The 41st edition of the conference to be held in San Diego, California, USA from 29 October-3 November 2022 will be no different! As the worldwide COVID-19 pandemic situations continues to evolve, an online registration option will be available for presenters and participants who are unable to attend in person due to travel restrictions.
General Chair
Tulika Mitra
Past Chair
Rolf Drechsler
Program Chair
Evangeline Young
Vice Program Chair
Jinjun Xiong,University at Buffalo (UB)
Tutorial & Special Session Chair
Robert Wille,Johannes Kepler University Linz
ACM SIGDA Representative
Yiyu Shi,Notre Dame University
Asian Representative
Takashi Sato,Graduate School of Informatics, Kyoto
European Representative
Ulf Schlichtmann,Technical University of Munich
Industry Liaison
Ismail S. K. Bustany,Xilinx
CEDA Representative
Tsung-Yi Ho,National Tsing Hua University
Original technical submissions on, but not limited to, the following topics are invited:
SYSTEM-LEVEL CAD
1.1 System Design
System-level specification, modeling, simulation, design flows
System-level issues for 3D integration
System-level design case studies and applications
HW/SW co-design, co-simulation, co-optimization, and co-exploration, platforms for emulation and rapid prototyping
Micro-architectural transformation
Multi-/many-core processor, GPU and heterogeneous SoC
Memory and storage architecture and system synthesis
System communication architecture, Network-on-chip design
Modeling, simulation, high-level synthesis, power/performance analysis, programming of heterogeneous computing platforms
Application driven system design for big data
Analysis and optimization of data centers
1.2 Embedded, Cyber-Physical (CPS), IoT
Systems and Software
AI and machine learning for embedded systems
HW/SW co-design for embedded systems
Compute, memory, storage, interconnect for embedded systems
Domain-specific accelerators
Energy/power management and energy harvesting
Real-time software and systems
Middleware, virtual machines, and runtime support
Dependable, safe, secure, trustworthy embedded systems
Embedded software: compilation, optimization, testing
CAD for IoT, edge and fog computing
Modeling, analysis, verification of CPS systems
Green computing (smart grid, energy, solar panels, etc.)
CAD for application domains including wearables, health care, autonomous systems, smart cities
1.3 Neural Networks and Deep Learning
Hardware and architecture for neural networks
Compilers for deep neural networks
Design method for learning on a chip
System-level design for (deep) neural computing
Neural network acceleration including GPU and ASICs
Safe and secure machine learning
Hardware accelerators for Artificial Intelligence
1.4 Reconfigurable Computing
Novel reconfigurable architectures (FPGA, CGRA, etc.)
Neural network acceleration on reconfigurable accelerators
High-level synthesis on reconfigurable architectures
Compilers for reconfigurable architectures
Reconfigurable fabric security
HW/SW prototyping and emulation on FPGAs
Post-synthesis optimization for FPGAs
FPGA-based prototyping for analog, mixed-signal, RF systems
1.5 Hardware Security, Security Architecture and Systems
Hardware Trojans, side-channel attacks, fault attacks and countermeasures
New physical attack vectors or methods for ASICs
Nano electronic security
Hardware-based security (CAD for PUF’s, RNG, AES etc.)
Split Manufacturing for security
Supply chain security and anti-counterfeiting
Artificial Intelligence for attack prevention systems
Design and CAD for security
Security implications of CAD
Trusted execution environments
Privacy-preserving computation
Cloud Computing data security
Sensor network security
1.6 Low Power and Approximate Computing in System Design
Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems
Energy- and thermal-aware application mapping and scheduling
Energy- and thermal-aware architectures, algorithms
Energy- and thermal-aware dark silicon system design
Hardware techniques for approximate/stochastic computing
SYNTHESIS, VERIFICATION, PHYSICAL DESIGN, ANALYSIS, SIMULATION, AND MODELING
2.1 High-Level, Behavioral, and Logic Synthesis and Optimization
High-level/Behavioral/Logic synthesis
Technology-independent optimization and technology mapping
Functional and logic timing ECO (engineering change order)
Resource scheduling, allocation, and synthesis
Interaction between logic synthesis and physical design
2.2 Testing, Validation, Simulation, and Verification
High-level/Behavioral/Logic modeling, validation, simulation
Formal, semi-formal, and assertion-based verification
Equivalence and property checking
Emulation and hardware simulation/acceleration
Post-silicon validation and debug
Digital fault modeling and simulation
Delay, current-based, low-power test
ATPG, BIST, DFT, and compression
Memory test and repair
Core, board, system, and 3D IC test
2.3 Cell-Library Design, Partitioning, Floorplanning, Placement
Cell-library design and optimization
Transistor and gate sizing
High-level physical design and synthesis
Estimation and hierarchy management
2D and 3D partitioning, floorplanning, and placement
Post-placement optimization
Buffer insertion and interconnect planning
2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification
2D and 3D clock network synthesis
2D and 3D global and detailed routing
Package-/Board-level
Chip-package-board co-design
Post-layout/-silicon optimization
Layout and routing issues for optical interconnects
2.5 Design for Manufacturability and Design for Reliability
Process technology characterization, extraction, and modeling
CAD for design/manufacturing interfaces
CAD for reticle enhancement and lithography-related design
Variability analysis and statistical design and optimization
Yield estimation and design for yield
Physical verification and design rule checking
Machine learning for smart manufacturing and process control
Analysis and optimization for device-level reliability issues
Analysis optimization for interconnect reliability issues
Reliability issues related to soft errors
Design for resilience and robustness
2.6 Timing, Power and Signal Integrity Analysis and Optimization
Deterministic and statistical static timing analysis, optimization
Power and leakage analysis and optimization
Circuit and interconnect-level low power design issues
Power/ground network analysis and synthesis
Signal integrity analysis and optimization
2.7 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling
Analog, mixed-signal, and RF noise modeling, simulation, test
Electromagnetic simulation and optimization
Device, interconnect and circuit extraction and simulation
Behavior modeling of devices and interconnect
Package modeling and analysis
Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)
CAD FOR EMERGING TECHNOLOGIES, PARADIGMS
3.1 Bio-inspired and Neuromorphic Computing, Biological Systems and Electronics, and New Computing Paradigms
Network and neuron models
Devices and hardware for neuromorphic computing
Non-von Neumann architectures
PEvent or spike-based hardware systems
CAD for biological computing systems
CAD for synthetic biology
CAD for bio-electronic devices, bio-sensors, MEMS Systems
3.2 Nanoscale and Post-CMOS Systems
New device structures and process technologies
New memory technologies (flash, PCM, STT-RAM, memristor)
Nanotechnologies, nanowires, nanotubes, graphene, etc.
Quantum computing
CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electro-optical) devices, circuits, and systems
CAD for nanophotonics and optical devices/ communication
DFM and reliability issues for emerging devices (3D, Nanophotonics, non-volatile logic/memory, etc.)
Device, interconnect and circuit extraction and simulation
Behavior modeling of devices and interconnect
Package modeling and analysis
Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)
Authors are asked to submit their work in two stages. In stage one (abstract submission), a title, abstract, and a list of all co-authors must be submitted via the ICCAD web submission site. In stage two (paper submission), the paper itself is submitted whereby the submitted abstract of stage one can still be modified. Authors are responsible for ensuring that their paper submission meets all guidelines, and that the PDF is readable.
Regular papers will be reviewed as finished papers; preliminary submissions will be at a disadvantage. Research papers with open-source software are highly encouraged where the software will be made publicly available (via GitHub or similar) with the camera-ready version if the paper has been accepted. For protecting the authors’ identities in the double-blind review process, please do not include direct link to the non-anonymized software yet in the submitted paper but indicate the open-source contribution on a textural basis only. Authors wanting to share GitHub repositories may want to look into using https://anonymous.4open.science/ which is an open-source tool that helps you to quickly double-blind your repository.
10月29日
2022
11月03日
2022
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2023 IEEE/ACM International Conference on Computer Aided Design
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