AboutComponents, Circuits, Devices and Systems; Photonics and Electrooptics; Power, Energy and Industry Applications
Keywords:Interconnect Reliability,interconnects,Integrated circuit interconnections,Materials reliability,3d-integration Packaging Technologies,electronic packaging,electrical characterisation,medical packaging,Circuit Subsystems,3d Integration,system-in-package,interposer,heterogeneous integration,Flip chip,miniturisation,Detectors,thermal management,power electronics,power electronics,
Scope:Flexible electronics, Harsh environment, Photonics, Advanced Materials, Heterogeneous Integration, Power electronics, Advanced Packaging, MEMS packaging, Medical electronics,
Sponsor Type:1; 9; 9