2021 IEEE 71th Electronic Components and Technology Conference ECTC

活动简介

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).

Sponsor Type:1

组委会

General Chair

Nancy Stoffel
GE Research

Vice General Chair

Rozalia Beica
AT&S

Program Chair

Ibrahim Guven
Virginia Commonwealth University

Assistant Program Chair

Karlheinz Bock
TU Dresden

Jr. Past General Chair

Christopher Bower
X-Display Company, Inc.

Sr. Past General Chair

Mark Poliks
Binghamton University

Sponsorship Chair

Wolfgang Sauter
Marvell Semiconductor, Inc.

Finance Chair

Patrick Thompson
Texas Instruments, Inc.

Publications Chair

Henning Braunisch
Intel Corporation

Publicity Chair

Eric Perfecto
IBM Research

Treasurer

Tom Reynolds
T3 Group LLC

Exhibits Chair

Alan Huffman
Micross Advanced Interconnect Technology

IT Coordinator

Florian Herrault
HRL Laboratories, LLC

Professional Development Course Chair

Kitty Pearsall
Boss Precision, Inc.

Conference Management

Lisa Renzi Ragar
Renzi & Company, Inc.

EPS Representative

Annette Teng
Promex Industries

征稿信息

重要日期

2021-02-28

初稿截稿日期

征稿范围

Highly rated abstracts are accepted for presentation at the ECTC conference. It is important that authors identify the subcommittees whose topic areas best fit their abstracts. Abstracts should include original and previously unpublished, non-confidential, and non-commercial information on new developments, technology, and knowledge in the areas including, but not limited to, those given below for each technical subcommittee：

Applied Reliability
Assembly and Manufacturing Technology
Emerging Technologies
Interconnections
Materials & Processing
Packaging Technologies
Photonics
RF, High-Speed Components & Systems
Thermal/Mechanical Simulation & Characterization
Interactive Presentations