The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design and optimization, to system software and applications.
Sponsor Type:1; 1; 9
General Co-Chairs
Sherief Reda, Brown Univ.
Yiran Chen, Duke Univ.
Technical Program Co-Chairs
Hai Li, Duke Univ.
Charles Augustine,Intel
Treasurer
Ajay Joshi,Boston Univ.
Local Arrangements Chair
Ayse K. Coskun, Boston Univ.
Zoom Arrangements
Xiang Che,GMU
Web/Registration Chair
Hiwot Tadese Kassa, UMich
Publications Chair
Fan Chen, IU
Design Contest Co-Chairs
Kapil Dev, Nvidia
Publicity Co-Chairs
Ilaria Scarabottolo, USI
Specific topics include, but are not limited to, the following three main tracks and sub-areas:
1. Technology, Circuits, and Architecture
1.1. Technologies
Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical,
printable, biomedical, battery, and alternative energy storage devices.
1.2. Circuits
Low-power digital circuits for logic, memory, reliability, clocking, power gating, resiliency, near-threshold and subthreshold, variability, and digital assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging, DC-DC converters, and analog assist schemes.
1.3. Logic and Architecture
Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics and other special purpose cores), cache, memory, arithmetic/Signal processing, cryptography, variability, asynchronous design, and nonconventional computing.
2. CAD, Systems, and Software
2.1. CAD Tools and Methodologies
CAD tools and methodologies for low-power and thermalaware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.
2.2. Systems and Platforms
Low-power, power-aware, and thermal-aware system design including data-center power delivery and cooling, Platforms for SoCs, embedded systems, approximate and brain-inspired computing, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and systemlevel power implications due to reliability and variability.
2.3. Software and Applications
Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, power optimizations through HW/SW interactions, and emerging software low-power applications.
07月26日
2021
07月28日
2021
初稿截稿日期
初稿录用通知日期
注册截止日期
2023年08月07日 奥地利 Vienna
2023 IEEE/ACM International Symposium on Low Power Electronics and Design2022年08月01日 美国 Boston
2022 IEEE/ACM International Symposium on Low Power Electronics and Design2018年07月23日 美国
2018 IEEE / ACM低功耗电子与设计国际研讨会2017年07月24日 台湾-中国 Taipei
2017 IEEE / ACM国际低功率电子设计研讨会2016年08月08日 美国 San Francisco,USA
2016国际低功耗电子学与设计研讨会2015年07月22日 意大利
2015年IEEE/ ACM国际低功耗电子和设计研讨会2014年08月11日 美国
2014年低功耗电子设计国际研讨会
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