2021 10th IEEE CPMT Symposium Japan ICSJ - 波兰vs阿根廷亚盘赔率

活动简介

"IEEE CPMT Symposium Japan (ICSJ)" is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November. This conference was inaugurated in 1992 as "The VLSI Packaging Workshop in Japan (VPWJ)" to provide a platform for you to communicate and interact with global leaders in packaging technology. Later in 2010, this conference was renamed to "ICSJ" and ICSJ2021 is the 10th ICSJ meeting, or 19th conference since establishing VPWJ. This year, ICSJ2021 will be a hybrid event of on-site and virtual meetings where several presentation options are available for the authors to select and the details will be announced on the official website at a later date.

Sponsor Type:1

组委会

General Chair:

Hideyuki Nasu (Furukawa Electric Co., Ltd)

Vice Chair:

Kazuyuki Nakagawa (Renesas Electronics Corporation)

Chris Bailey (University of Greenwich)

Program Chair:

Taiji Sakai (Fujitsu Interconnect Technologies Ltd.)

Beomjoon Kim (The University of Tokyo)

Eiji Higurashi (AIST)

Conference Relations Chair:

Shinya Takyu (LINTEC Corporation)

Kiyokazu Yasuda (Osaka University)

Shigenori Aoki (LINTEC Corporation)

Promotion Chair:

Takaaki Ishigure (Keio University)

Yutaka Uematsu (Hitachi, Ltd.)

Financial Chair:

Yoshitomo Ono (LINTEC Corporation)

Hideyuki Nawata (Nissan Chemical Corporation)

Sponsor-Care Chair:

Yasuhiro Ikeda (Hitachi, Ltd.)

Kei Murayama (Shinko Electric Industries Co., Ltd.)

Publication/Web Chair:

Junichi Inoue (Kyoto Institute of Technology)

Hidetoshi Numata (IBM Research - Tokyo)

Arrangement Chair:

Katsumi Terada (Toray Engineering Co., Ltd.)

Kentaro Kaneko (Kyoto University)

Takahiro Matsubara (KYOCERA Corporation)

征稿信息

重要日期

2021-05-28

摘要截稿日期

2021-07-09

摘要录用日期

征稿范围

In 2021, our focus is on key electronics packaging technologies for the next-generation mobile networks and their applications for 5G and B5G services, and emphasizes on the following main topics: Photonics, Advanced Packaging, Process & Material, Power & Automotive Electronics, Bioelectronics, and Sensing Technologies.