2021 IEEE Custom Integrated Circuits Conference CICC

活动简介

The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design problems, improve circuit design techniques, get exposure to new technology areas, and network with peers, authors and industry experts.

There are 3 days of Technical Sessions that include lecture presentations addressing state of the art developments in integrated circuit design. The Educational Sessions are a full day of tutorials instructed by recognized invited speakers. The Panels, and Forums are presented throughout the conference to enrich the learning experience of the attendees. The Panel Discussions and Forums are presented by leaders from the IC industry. CICC includes an Exhibits Hall that is open in the evenings where Semiconductor manufacturers, software tool suppliers, silicon IP providers, design-service houses, and technical book publishers offer displays and demonstrations of their products. CICC is sponsored by the IEEE Solid-State Circuits Society and technically co-sponsored by the IEEE Electron Devices Society.

Sponsor Type:1

组委会

Special Sessions:

Yanjie “Jay” Wang
South China University of Technology
yjwang2016@qq.com

Best Papers and Awards:

Nagendra Krishnapura
IIT Madras
nagendra@ee.iitm.ac.in

Sponsorship and Exhibits:

Eric Soenen
TSMC
ESoenen@tsmc.com

Outreach:

Hanh-Phuc Le
UT San Diego
hanhphuc@ucsd.edu

Mentorship:

Julian Tham
Infineon Technologies
jtham@ieee.org

征稿信息

重要日期

2021-11-29

初稿截稿日期

征稿范围

CICC 2021 presents papers in the following areas:

Analog Circuits and Techniques for areas such as communications, biomedical, aerospace, automotive, energy, environment, analog computing and security applications, ranging from building blocks to silicon sensors, interfaces, and novel clock generation architectures.

Data Converters including but not limited to A/D, D/A, time-to-digital, frequency-to-digital and analog to information converters of all types enabled by new techniques, architectures, or technologies.

Design Foundations for novel digital, analog, mixed-signal, and memory circuit techniques for present and emerging applications (deep learning, autonomous vehicles, IoT, security, quantum computing). Modeling and simulation of advanced CMOS (FinFET, UTTB-SOI) and beyond-CMOS devices (MEMS, GaN, Non-Volatile Memories, STT) to improve design quality, efficiency, and reliability. Design for manufacturing, test, aging, security, and reliability (novel DFT circuits, system-level testing). High-level system modeling, digital/analog design infrastructure, and verification and emulation for complex SoCs.

Digital Circuits, SoCs, and Systems solicit hardware-based papers in technologies that enhance integrated systems including processors, accelerators, memory systems, with applications in artificial intelligence, security, autonomous transportation, cloud computing, sensing, and communication.

Emerging Technologies, Systems, and Applications solicit hardware focused papers in the technologies of tomorrow extending from new device to system integration and applications with focus on, but not limited to:

Next-generation technology and sensors including devices, integration, and packaging including nano-primitives, non-silicon based technology, and advanced assembly. Sensor interfaces for MEMS, mm-wave/THz, flexible, printed, large-area and organic electronics, electronic-photonic co-design, and silicon photonics.

Biomedical circuits, systems, and applications including neural interfaces, microarrays, lab-on-a-chip, bio-inspired circuits, implantable and/or wearable systems, closed-loop systems with sensing and actuation, medical imaging, and other biosensors including biomedical signal processing SoCs.