活动简介

The IEEE International Conference on Microelectronics (ICM) has been held in numerous countries across the Southern Europe and Western and Southern Asia for the past 28 years. The 29th edition of the conference will be hosted by Arts, Sciences & Technology University in Lebanon (AUL) at the Crowne Plaza Hotel, Hamra, Beirut in December 2017. In ICM 2017, several topics will be discussed such as Circuits and Systems, CAD Tools and Design and Micro/Nano electronics and special topics. 
It will include oral, poster sessions and tutorials given by experts in state-of-the-art topics. The regular technical program will run for three days. Moreover tutorial sessions will be held on the first day of the conference. Perspective authors are invited to upload full papers using the ICM2017 Electronic Submission Portal below. Regular papers should be prepared with the official IEEE paper template of no more than 4 pages including results, figures and references: Paper Template. 
Accepted papers will be published in the electronic conference proceedings in IEEE XPLORE.

征稿信息

重要日期

2017-07-16
初稿截稿日期
2017-09-18
初稿录用日期
2017-10-13
终稿截稿日期

征稿范围

General Circuits and Systems

  • Analog and RF circuit design techniques

  • Digital signal and data processing

  • Wireless communication systems

  • Optical Communications

  • Nonlinear circuits

  • System on Chip (SoCs)

  • VLSI for Signal and Image Processing

  • Integrated antenna and front-end co-design

  • Signal Processing in Communications

CAD Tools and Design

  • Simulation (process, device, circuit, logic, timing, functional)

  • Layout (placement, routing, floor planning, symbolic, ERC, DRC)

  • Silicon optimization

  • Parallel embedded systems

  • Testing: Formal verification

  • CAD for FPGAs

  • High level synthesis tools

  • Design for testability

Micro/Nano electronics

  • Device characterization and modeling

  • Device physics and novel structures

  • Process technology, CMOS, BJT

  • BiCMOS, GaAs

  • Reliability and failure analysis

  • Optoelectronics

  • MEMS Devices

  • Packaging and surface mount technology

Special Session

  • Topic I  : Virtual Reality

  • Topic II : Biomedical Instrumentations

  • Topic III: Renewable Energy

  • Topic IV : Emerging Technologies

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重要日期
  • 会议日期

    12月10日

    2017

    12月13日

    2017

  • 07月16日 2017

    初稿截稿日期

  • 09月18日 2017

    初稿录用通知日期

  • 10月13日 2017

    终稿截稿日期

  • 12月13日 2017

    注册截止日期

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